MediaTek Dimensity 7050 vs Qualcomm Snapdragon 8 Gen 3

We’ve conducted a comprehensive side-by-side comparison between the latest Dimensity 7050 and Snapdragon 8 Gen 3 SoCs, from Mediatek and Qualcomm respectively. Our analysis delves into the performance of these 8-core processors, based on Geekbench, Antutu, and 3DMark benchmark results, providing detailed technical comparisons.

Review

General comparison of performance, power consumption, and other indicators
CPU Performance
Evaluation of Single-Core and Multi-Core Processor Performance
Gaming Performance
Gaming and OpenCL/Vulkan Performance of the Graphics Processing Unit (GPU)
Battery life
Energy Efficiency in Battery Usage
Tech Insist Score
Overall Performance Rating of the Chip

Key Differences

Main differences and advantages of each chip
Pros of Dimensity 7050
  • Dimensity 7050 has 3.90% higher GPU clock speed than Snapdragon 8 Gen 3 (800 vs 770 MHz).
Pros of Snapdragon 8 Gen 3
  • Snapdragon 8 Gen 3 has 26.92 % higher CPU clock speed than Dimensity 7050 ( 3300 vs 2600 MHz).
  • Snapdragon 8 Gen 3 has 50.00 % higher memory frequency than Dimensity 7050 ( 4800 vs 3200 MHz).
  • Snapdragon 8 Gen 3 has 33.33 % smaller sized transistor than Dimensity 7050 ( 4 vs 6 nm).
  • Snapdragon 8 Gen 3 has 282.75 % better AnTuTu 9 score than Dimensity 7050 ( 2109 K vs 551 K).
  • Snapdragon 8 Gen 3 has latest instruction set, hence better than Dimensity 7050 .

Benchmarks

Evaluating performance through competitive testing in leading benchmarks.

AnTuTu 10

The AnTuTu Benchmark evaluates CPU, GPU, RAM, and I/O capabilities across various scenarios.
CPU 144109 495720
GPU 140847 914123
Memory 126627 361002
UX 139513 338475
Total score 551096 2109320

GeekBench 6

The GeekBench test shows raw single-threaded and multithreaded CPU performance
Single-Core Score
Multi-Core Score

3DMark

A cross-platform benchmark that assesses graphics performance in Vulkan (Metal)
3DMark Wild Life Performance
Stability 99% -
Graphics test - -
Score 4200 -

Specifications

Full list of technical specifications of Dimensity 7050 and Dimensity 9300

CPU

Architecture 2x 2.6 GHz – Cortex-A78
6x 2 GHz – Cortex-A55
1x 3.3 GHz – Cortex-X4
3x 3.15 GHz – Cortex-A720
2x 2.96 GHz – Cortex-A720
2x 2.26 GHz – Cortex-A520
Cores 8 8
Base Frequency 2000MHz 2260MHz
Turbo Frequency 2600MHz 3300MHz
Instruction set ARMv8.2-A ARMv9-A
L2 cache - -
L2 cache - -
L3 cache - 12 MB
Process 6 nanometers 4 nanometers
Transistor count - -
TDP (Sustained Power Limit) 4 W -

Graphics

GPU name Mali-G68 MC4 Adreno 750
Architecture Valhall 2 Adreno 700
GPU frequency 800 MHz 770 MHz
Pipelines 4 -
Shading units 64 -
Total shaders 128 -
FLOPS 686 Gigaflops -
Vulkan version 1.1 -
OpenCL version 2.0 -
DirectX version 12 -

AI Accelerator

Neural processor (NPU) MediaTek APU 3.0 Hexagon

Memory

Memory type LPDDR5 LPDDR5X
Memory frequency 3200 MHz 4800 MHz
Bus - -
Max bandwidth - 77 Gbit/s
Max size 16 GB 24 GB

Multimedia (ISP)

Storage type UFS 2.1, UFS 2.2, UFS 3.0, UFS 3.1 UFS 4.0
Max display resolution 2520 x 1080 3840 x 2160
Max camera resolution 1x 200MP 1x 200MP
Video capture 4K at 30FPS 8K at 30FPS, 4K at 120FPS
Video playback 4K at 30FPS 8K at 30FPS, 4K at 120FPS
Video codecs H.264, H.265, VP9 H.264, H.265, AV1, VP8, VP9
Audio codecs AAC, AIFF, CAF, MP3, MP4, WAV AAC, AIFF, CAF, MP3, MP4, WAV

Connectivity

Modem - Snapdragon X75
4G support LTE Cat. 18 LTE Cat. 24
5G support Yes Yes
Download speed 5G Up to 2770 Mbps Up to 10000 Mbps
Download speed 4G - -
Upload speed 5G Up to 1250 Mbps Up to 3500 Mbps
Upload speed 4G - -
Wi-Fi 6 7
Bluetooth 5.2 5.4
Navigation GPS, GLONASS, Beidou, Galileo, QZSS, NAVIC GPS, GLONASS, Beidou, Galileo, QZSS, NAVIC

Info

Announced May 2023 October 2023
Class Mid range Flagship
Model number - SM8650-AB
Official page Dimensity 7050 official site Snapdragon 8 Gen 3 official site